Proceedings of the 3rd International Seminar on Education Innovation and Economic Management (SEIEM 2018)

Application of the Computer Assembly Virtual Platform in Higher Vocational Education

Authors
Yanchao Liu, Yizhen Liu
Corresponding Author
Yanchao Liu
Available Online January 2019.
DOI
10.2991/seiem-18.2019.142How to use a DOI?
Keywords
Virtual simulation; Eon studio; computer assembly
Abstract

In higher vocational education, it is found that most schools have tight budgets when it is talking about the practical teaching of computer assembly and maintenance,. Besides, the hardware equipment provided to students for experiments is poor, and it will bear unnecessary losses in the process of students' realization. The paper explains that it is an effective solution to this problem to use the computer assembly virtual simulation platform to carry out experimental teaching. The virtual simulation experiment teaching is a new development direction, which can promote the reform of teaching forms, teaching methods and teaching concepts, and effectively solve the problems in teaching, thus improving the quality of experimental teaching.

Copyright
© 2019, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 3rd International Seminar on Education Innovation and Economic Management (SEIEM 2018)
Series
Advances in Social Science, Education and Humanities Research
Publication Date
January 2019
ISBN
10.2991/seiem-18.2019.142
ISSN
2352-5398
DOI
10.2991/seiem-18.2019.142How to use a DOI?
Copyright
© 2019, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Yanchao Liu
AU  - Yizhen Liu
PY  - 2019/01
DA  - 2019/01
TI  - Application of the Computer Assembly Virtual Platform in Higher Vocational Education
BT  - Proceedings of the 3rd International Seminar on Education Innovation and Economic Management (SEIEM 2018)
PB  - Atlantis Press
SP  - 545
EP  - 548
SN  - 2352-5398
UR  - https://doi.org/10.2991/seiem-18.2019.142
DO  - 10.2991/seiem-18.2019.142
ID  - Liu2019/01
ER  -