Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

DOI

10.2991/icmea-17.2018.9How to use a DOI?

Keywords

Sn-0.3Ag-0.7Cu-0.5Bi-Ni solder; intermetallic compound; interval aging; thickness

Abstract

To simulate the application environment of a number of electronic products, the growth of Sn-0.3Ag-0.7Cu-0.5Bi-Ni/Cu solder joints with low content of Ag was investigated during aging in an interval mode. It shows that the intermetallic compound (IMC) (Cu,Ni)6Sn5 layer becomes thicker with increasing aging time. The growth of IMC (Cu,Ni)6Sn5 layer during aging follows the diffusion control mechanism. Furthermore, it is demonstrated that there is no IMC Cu3Sn layer appear whatever increasing the aging time. It is explained the phenomenon is mainly attribute to the interval aging mode. According to kinetics, the activation energy is not high enough to overcome the energy obstacle due to the interval aging mode and finally the Cu3Sn phase doesn't form. Hence, the reliability of solder joints is improved.

Copyright

© 2018, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Min Qu
AU  - Yan Cui
AU  - Fengbin Liu
AU  - Zhiwei Jiao
AU  - Yuan Liu
AU  - Jun Cheng
PY  - 2018/02
DA  - 2018/02
TI  - Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate
BT  - Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)
PB  - Atlantis Press
SP  - 37
EP  - 40
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmea-17.2018.9
DO  - 10.2991/icmea-17.2018.9
ID  - Qu2018/02
ER  -