Electrodeposition Behaviors of Zn-Ni Alloy on Copper Foil with Carrier

DOI

10.2991/icaemt-15.2015.83How to use a DOI?

Keywords

Electrodeposition, Zn-Ni Alloy, Ultra-thin copper foil, Peeling layer, copper carrier

Abstract

Zn-Ni alloy is a promising peeling layer of ultra-thin copper foil with carrier support due to its good binding properties with copper matrix. We present here our recent work on the electrodeposition behaviors of Zn-Ni alloy peeling layer on ultra-thin copper foil with carrier support by cyclic voltammetry and chronoamperometry. The results show that in pyrophosphate solution the deposition of Zn-Ni alloy on copper foil is a normal co-deposition the deposition processes start with the deposition of nickel on carrier copper foil, followed by the co-deposition of zinc-nickel upon the reach of zinc deposition potential. Moreover, such deposition is a quasi-reversible process controlled by diffusion and the nucleation of Zn-Ni alloy follows a three-dimensional instantaneous nucleation model.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Gengfeng Deng
AU  - Qinghua Zeng
AU  - Jueqi Huang
PY  - 2015/08
DA  - 2015/08
TI  - Electrodeposition Behaviors of Zn-Ni Alloy on Copper Foil with Carrier
BT  - Proceedings of the 2015 International Conference on Advanced Engineering Materials and Technology
PB  - Atlantis Press
SP  - 423
EP  - 428
SN  - 2352-5401
UR  - https://doi.org/10.2991/icaemt-15.2015.83
DO  - 10.2991/icaemt-15.2015.83
ID  - Deng2015/08
ER  -