Application of Six Sigma Methodology to Reduce Pseudo Soldering in SMT Process

DOI

10.2991/mse-17.2017.27How to use a DOI?

Keywords

SMT; Pseudo Soldering; Six Sigma

Abstract

In order to reduce the failure rate of SMT weld. Six Sigma methodology was used to analyze the solder joint faults in SMT, to determine the key quality characteristics, and to find out the key influencing factors of SMT process as the improvement focal point. The results demonstrated that the failure rate of SMT weld was greatly reduced after the improvement of the furnace temperature curve, the replacement of solder paste, The manual patch and PCB warp. The research also showed that six sigma methodology is a kind of scientific management method, which is suitable for wide application in the manufacturing industry.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Gang Yang
AU  - Zhen-Hua Hu
AU  - Jiu-Yu Li
AU  - Lei Xu
AU  - Long-Sheng Xu
PY  - 2017/10
DA  - 2017/10
TI  - Application of Six Sigma Methodology to Reduce Pseudo Soldering in SMT Process
BT  - Proceedings of the 3rd Annual 2017 International Conference on Management Science and Engineering (MSE 2017)
PB  - Atlantis Press
SP  - 106
EP  - 109
SN  - 2352-5428
UR  - https://doi.org/10.2991/mse-17.2017.27
DO  - 10.2991/mse-17.2017.27
ID  - Yang2017/10
ER  -