Proceedings of the 3rd International Conference on Mechatronics, Robotics and Automation

Evaluation of the Thermal Interface Crack Problem in Packaging Structure

Authors
Fengnan Guo, Jianwei Cui, Yuanhe Wang, Yu Liu, Licheng Guo
Corresponding Author
Fengnan Guo
Available Online April 2015.
DOI
https://doi.org/10.2991/icmra-15.2015.35How to use a DOI?
Keywords
Packaging structure; interaction energy integral; thermal stress intensity factors; interface crack.
Abstract
In this paper, the interaction integral method is developed to study the thermal fracture mechanics of packaging structures. The present interaction integral can be proved to be domain-independent for the packaging structures with complex interfaces. The mixed-mode thermal stress intensity factors (TSIFs) of the packaging structure can be obtained using the present method. The domain-independence of the present method is verified. The thermal fracture problems of flip-chip packaging with complex interfaces are investigated.
Open Access
This is an open access article distributed under the CC BY-NC license.

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Proceedings
3rd International Conference on Mechatronics, Robotics and Automation
Part of series
Advances in Computer Science Research
Publication Date
April 2015
ISBN
978-94-62520-76-9
ISSN
2352-538X
DOI
https://doi.org/10.2991/icmra-15.2015.35How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Fengnan Guo
AU  - Jianwei Cui
AU  - Yuanhe Wang
AU  - Yu Liu
AU  - Licheng Guo
PY  - 2015/04
DA  - 2015/04
TI  - Evaluation of the Thermal Interface Crack Problem in Packaging Structure
BT  - 3rd International Conference on Mechatronics, Robotics and Automation
PB  - Atlantis Press
SP  - 171
EP  - 174
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmra-15.2015.35
DO  - https://doi.org/10.2991/icmra-15.2015.35
ID  - Guo2015/04
ER  -