Evaluation of the Thermal Interface Crack Problem in Packaging Structure
Authors
Fengnan Guo, Jianwei Cui, Yuanhe Wang, Yu Liu, Licheng Guo
Corresponding Author
Fengnan Guo
Available Online April 2015.
- DOI
- 10.2991/icmra-15.2015.35How to use a DOI?
- Keywords
- Packaging structure; interaction energy integral; thermal stress intensity factors; interface crack.
- Abstract
In this paper, the interaction integral method is developed to study the thermal fracture mechanics of packaging structures. The present interaction integral can be proved to be domain-independent for the packaging structures with complex interfaces. The mixed-mode thermal stress intensity factors (TSIFs) of the packaging structure can be obtained using the present method. The domain-independence of the present method is verified. The thermal fracture problems of flip-chip packaging with complex interfaces are investigated.
- Copyright
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Fengnan Guo AU - Jianwei Cui AU - Yuanhe Wang AU - Yu Liu AU - Licheng Guo PY - 2015/04 DA - 2015/04 TI - Evaluation of the Thermal Interface Crack Problem in Packaging Structure BT - Proceedings of the 3rd International Conference on Mechatronics, Robotics and Automation PB - Atlantis Press SP - 171 EP - 174 SN - 2352-538X UR - https://doi.org/10.2991/icmra-15.2015.35 DO - 10.2991/icmra-15.2015.35 ID - Guo2015/04 ER -