Numerical Simulation Study on Flow Characteristics of Supercritical Carbon Dioxide in a New Cleaning Chamber
- 10.2991/icadme-15.2015.51How to use a DOI?
- Supercritical carbon dioxide, cleaning chamber, flow characteristics, wall shear stress
Large amounts of organic solvents and pure water have been consumed in conventional semiconductor cleaning technology. And low dielectric constant (Low-K) material may be destroyed easily during the cleaning process, which will also cause structural collapse of the material. All these shortcomings can be rid by cleaning technique using supercritical carbon dioxide (SC-CO2) as a medium. As an environmental friendly solvent, SC-CO2 has been applied in wafer cleaning field for some unique advantages such as high solvency, high diffusivity, low viscosity, low surface tension and other characteristics. In this study, a new cleaning chamber using SC-CO2 is designed and a simplified model is established by CFD software. On this basis, the flow field characteristics of SC-CO2 in the chamber are simulated, and the corresponding wall shear stress distribution is obtained by altering the rotation speed of the inner cylinder and the outlet pressure of multi-directional nozzles. The simulation results aim to offer ideas for expanding applications of SC-CO2 as a green solvent.
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Guangya Jin AU - Ya Wang AU - Jiapeng Wang AU - Songyang Zhu PY - 2015/10 DA - 2015/10 TI - Numerical Simulation Study on Flow Characteristics of Supercritical Carbon Dioxide in a New Cleaning Chamber BT - Proceedings of the 5th International Conference on Advanced Design and Manufacturing Engineering PB - Atlantis Press SP - 255 EP - 260 SN - 2352-5401 UR - https://doi.org/10.2991/icadme-15.2015.51 DO - 10.2991/icadme-15.2015.51 ID - Jin2015/10 ER -