Lagrange multiplying method based calculation of material flaw thickness Exploiting ultrasonic multipath detection

DOI

10.2991/peee-15.2015.56How to use a DOI?

Keywords

Ultrasonic nondestructive testing, Multipath, Sizing, Flaw, Lagrange multiplying method.

Abstract

A signal model based on the multipath higher order reflections of the flaw is reviewed to detect the sized flaw by ultrasound nondestructive testing, and the different paths are pre-defined and identified to form the corresponding equations. Three paths are studied, DRP, MP-C and MP-W. DRP and MP-C are utilized to measure the flaw from the top, and MP-W is from its bottom. Ultrasonic imaging is formed and synthesized by all the identified paths and all the tests to make the thickness of flaw be revealed. The thickness of the flaw is turned to two optimization problems based on different path profiles by only one pitch-catch measurement, and the problem is estimated based on Lagrange multiplying method. Simulations and experimentations demonstrate that the flaw sizing can be calculated utilizing the time-of-arrivals of the multipath signals, even with only one pitch-catch measurement.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - X.Z. Shen
AU  - S.J. Chen
PY  - 2015/04
DA  - 2015/04
TI  - Lagrange multiplying method based calculation of material flaw thickness Exploiting ultrasonic multipath detection
BT  - Proceedings of the 2015 International Conference on Power Electronics and Energy Engineering
PB  - Atlantis Press
SP  - 211
EP  - 214
SN  - 2352-5401
UR  - https://doi.org/10.2991/peee-15.2015.56
DO  - 10.2991/peee-15.2015.56
ID  - Shen2015/04
ER  -