A Review: The wettability and oxidation resistance of sn-zn-x lead-free solder joints

DOI

10.2991/peee-15.2015.50How to use a DOI?

Keywords

Lead-free solders, Alloying elements, Wettability, Oxidation resistance.

Abstract

With the development of lead-free solders, Sn-Zn solder was attracted increasing attention due to its low melting point, cost saving and excellent mechanical properties. However, there are many problems need to resolved, such as poor wettability and oxidation resistance. In order to overcome these shortcomings, more recent studies on Sn-Zn solder have proposed strategies aimed at obtaining a good wettability and solderability by adding a third or fourth elements, such as In, Ga, P, Bi, Ni, Cr, Ag, Cu, Al and rare earth. This work summarizes the effects of alloying elements to the wettability and oxidation resistance of Sn-Zn lead-free solders.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - L. Sun
AU  - L. Zhang
PY  - 2015/04
DA  - 2015/04
TI  - A Review: The wettability and oxidation resistance of sn-zn-x lead-free solder joints
BT  - Proceedings of the 2015 International Conference on Power Electronics and Energy Engineering
PB  - Atlantis Press
SP  - 188
EP  - 190
SN  - 2352-5401
UR  - https://doi.org/10.2991/peee-15.2015.50
DO  - 10.2991/peee-15.2015.50
ID  - Sun2015/04
ER  -