Acquire 3D Print Three-dimensional Data Field and Filling Optimization 2D Contour Lines
- DOI
- 10.2991/meic-14.2014.67How to use a DOI?
- Keywords
- rapid prototyping manufacturing technology; feature recognition; entity triangulation; layered; 3D printer
- Abstract
With the development of rapid prototyping technology and computer technology, the rapid molding technology and the computer technology is more and more close. Based on the model of 3D data field capture, then according to the software conversion of STL format entity triangulation of 3D data and stratification, obtain 2D contour lines by layering, fast fitting algorithm utilizing metaball modeling technology. To transform the design of the existing model and modify the source file through a series of algorithm and the measures using 3D software, thus conducive to the formation of a 3D file to print. First of all, design task and functional requirements of the 3D model are analyzed, then, through a series of approximation algorithms and knowledge to determine the overall scheme of model 3D printing, including three-dimensional design of the model, the three-dimensional manufacturing feature recognition, the original model entity triangulation, hierarchical modeling. Finally, through rational analysis, temperature control, layout model, through the 3D printer to print out the entity model, and the structure of the model is analyzed.
- Copyright
- © 2014, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Shigang Wang AU - Yue Han AU - Fengjuan Wang AU - Fansong Meng PY - 2014/11 DA - 2014/11 TI - Acquire 3D Print Three-dimensional Data Field and Filling Optimization 2D Contour Lines BT - Proceedings of the 2014 International Conference on Mechatronics, Electronic, Industrial and Control Engineering PB - Atlantis Press SP - 299 EP - 302 SN - 2352-5401 UR - https://doi.org/10.2991/meic-14.2014.67 DO - 10.2991/meic-14.2014.67 ID - Wang2014/11 ER -