Proceedings of the International Conference on Logistics, Engineering, Management and Computer Science

The Application of Regression Analysis in Modeling Interconnect Resistance

Authors
Baojun Chen, Ke Zhao, Yanjie Ju
Corresponding Author
Baojun Chen
Available Online May 2014.
DOI
https://doi.org/10.2991/lemcs-14.2014.156How to use a DOI?
Keywords
interconnect; resistance;Regression analysis;MOM;IC
Abstract
As clock frequencies exceed giga-Hertz, the skin depth in analog and digital circuits decreases heavily. The technology scaling have lead to complications that pose significant challenges to on-chip interconnect design, such as the distortion of signal pulses. One of the most important causes of pulse distortion is the frequency-dependence of conductor loss, which can be incorporated into circuit models for interconnects as frequency-dependent resistance per-unit-length. This makes accurate resistance necessary in simulation. In order to achieve high simulation efficiency, closed-form formulae are often used to represent frequency-dependent resistance of interconnects. In this letter, two closed-form formulae for the frequency-dependent per-unit-length resistance of rectangular cross-sectional interconnects are presented. The frequency-dependent per-unit-length resistance of a rectangular interconnect line or an interconnect line with a ground plane structure is first obtained by the method of moments (MOM). Based on this strict numerical MOM results, the novel closed-form formulae for a rectangular interconnect are fitted out using the regression analysis. The formulae can be widely used for analyzing on-chip power grid IR-drop when the frequency is changing. Compared to the previously published formulae for an interconnect, the formula provided here is more accurate during the frequency transition range.
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This is an open access article distributed under the CC BY-NC license.

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Proceedings
International Conference on Logistics Engineering, Management and Computer Science (LEMCS 2014)
Part of series
Advances in Intelligent Systems Research
Publication Date
May 2014
ISBN
978-94-6252-010-3
ISSN
1951-6851
DOI
https://doi.org/10.2991/lemcs-14.2014.156How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Baojun Chen
AU  - Ke Zhao
AU  - Yanjie Ju
PY  - 2014/05
DA  - 2014/05
TI  - The Application of Regression Analysis in Modeling Interconnect Resistance
BT  - International Conference on Logistics Engineering, Management and Computer Science (LEMCS 2014)
PB  - Atlantis Press
SN  - 1951-6851
UR  - https://doi.org/10.2991/lemcs-14.2014.156
DO  - https://doi.org/10.2991/lemcs-14.2014.156
ID  - Chen2014/05
ER  -