Proceedings of the International Conference on Logistics, Engineering, Management and Computer Science

Development and Situation of Boron Removal from Solar Grade Silicon

Authors
Shuhui Shi, Xinrong Yang
Corresponding Author
Shuhui Shi
Available Online May 2014.
DOI
10.2991/lemcs-14.2014.25How to use a DOI?
Keywords
Metallurgical grade silicon; solar grade silicon; gaseous-boron removal; solid-boron removal; electrorefining-boron removal
Abstract

In recent years, more and more attentions have been paid to the research of producing solar grade silicon by the metallurgical method,boron removal has always been difficult and important in various technologies. In this paper the recent research on removing boron is summarized. The boron removal is calssfied by the different forms of boron in removing boron: gaseous-boron removal, solid-boron removal and electrorefining-boron removal. The principle and outcomes of each boron removal craft are survered and compared, the possible application prospect is predicted.

Copyright
© 2014, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the International Conference on Logistics, Engineering, Management and Computer Science
Series
Advances in Intelligent Systems Research
Publication Date
May 2014
ISBN
10.2991/lemcs-14.2014.25
ISSN
1951-6851
DOI
10.2991/lemcs-14.2014.25How to use a DOI?
Copyright
© 2014, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Shuhui Shi
AU  - Xinrong Yang
PY  - 2014/05
DA  - 2014/05
TI  - Development and Situation of Boron Removal from Solar Grade Silicon
BT  - Proceedings of the International Conference on Logistics, Engineering, Management and Computer Science
PB  - Atlantis Press
SP  - 107
EP  - 111
SN  - 1951-6851
UR  - https://doi.org/10.2991/lemcs-14.2014.25
DO  - 10.2991/lemcs-14.2014.25
ID  - Shi2014/05
ER  -