Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference

Variations in Hoop Stresses among Silicon Dioxide, Polystyrene and Polypropylene Carbonate Through Silicon Via Liners

Authors
Juma Mary Atieno, Xuliang Zhang, He Song bai
Corresponding Author
Juma Mary Atieno
Available Online December 2015.
DOI
10.2991/jimet-15.2015.205How to use a DOI?
Keywords
Analysis System, Interconnect, Liner, Reliability, Through Silicon Via.
Abstract

Through Silicon Via are the widely used interconnects in the semiconductors industry. They are designed in different ways to meet the market demands. These interconnect need protection from both internal and external pressures. The pressures result from heating of the components on the chip which enhances expansion and contraction. Silicon dioxide has been the commonly used Through Silicon Via liner. We propose the use of polystyrene and polypropylene carbonate as liners to reduce overdependence on silicon dioxide. We compare deformations and stresses among the materials and noted that silicon dioxide had the least deformation and hoop stress values. We did further research and realized that the latter two materials have some good properties not found in silicon dioxide so they can also serve as better liners.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference
Series
Advances in Computer Science Research
Publication Date
December 2015
ISBN
978-94-6252-129-2
ISSN
2352-538X
DOI
10.2991/jimet-15.2015.205How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Juma Mary Atieno
AU  - Xuliang Zhang
AU  - He Song bai
PY  - 2015/12
DA  - 2015/12
TI  - Variations in Hoop Stresses among Silicon Dioxide, Polystyrene and Polypropylene Carbonate Through Silicon Via Liners
BT  - Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference
PB  - Atlantis Press
SP  - 1089
EP  - 1092
SN  - 2352-538X
UR  - https://doi.org/10.2991/jimet-15.2015.205
DO  - 10.2991/jimet-15.2015.205
ID  - MaryAtieno2015/12
ER  -