Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference

Research on high density SMT reliability of aerospace products

Authors
Xuming Liu, Baiyang Cao, Yin Xu, Ran Xiao, Hailong Zhao
Corresponding Author
Xuming Liu
Available Online December 2015.
DOI
10.2991/jimet-15.2015.155How to use a DOI?
Keywords
high density aerospace products BGA reliability
Abstract

High density assembly of aerospace electronics equipment is an important direction of research linking technology. Based on the experiment, the paper complete the solder of high density aerospace products under different welding parameters , including PBGA and CBGA in different sizes. Secondly, execute the PCB board to thermal cycle test and vibration test which was welded under different process parameters, and finally through the Metallurgical Microscopy and scanning electron microscope finished the analysis. In the experimental results, found that it contribute to the formation of Cu/Sn alloy if the peak temperature value is higher than 220 for at least two seconds. The form of Cu/Sn alloy will improve the reliability of the solder joints.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference
Series
Advances in Computer Science Research
Publication Date
December 2015
ISBN
978-94-6252-129-2
ISSN
2352-538X
DOI
10.2991/jimet-15.2015.155How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Xuming Liu
AU  - Baiyang Cao
AU  - Yin Xu
AU  - Ran Xiao
AU  - Hailong Zhao
PY  - 2015/12
DA  - 2015/12
TI  - Research on high density SMT reliability of aerospace products
BT  - Proceedings of the 2015 Joint International Mechanical, Electronic and Information Technology Conference
PB  - Atlantis Press
SP  - 831
EP  - 836
SN  - 2352-538X
UR  - https://doi.org/10.2991/jimet-15.2015.155
DO  - 10.2991/jimet-15.2015.155
ID  - Liu2015/12
ER  -