Research on Anti Impact Simulation of Sensor Electronic Equipment

DOI

10.2991/icsma-16.2016.67How to use a DOI?

Keywords

Sensor electronic equipment; Vibration isolation; Vibration; Shock; Finite element simulation.

Abstract

This paper analyses the mechanism of impact vibration on electronic equipment of the sensor and the vibration isolation, as well as buffering mechanism of cushioning materials. And for the impact environment of electronic equipment of the sensor, the design of the structure against the impact of high overload is made. The vibration isolator of the sensor is developed by using both of potting material and the rubber - foam aluminum overlap method. The shock wave is attenuated by a multi - layer dielectric absorption technique, and the shock resistance of the sensor system is improved. ANSYS software obtains the maximal stress, maximum displacement, stress time curve, and displacement time curve of the system for transient impact analysis of the electronic sensor equipment. The simulation results validate the rationality of the design method against high overload impact.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Kai Li
AU  - Yan Han
PY  - 2016/12
DA  - 2016/12
TI  - Research on Anti Impact Simulation of Sensor Electronic Equipment
BT  - Proceedings of the 2016 4th International Conference on Sensors, Mechatronics and Automation (ICSMA 2016)
PB  - Atlantis Press
SP  - 375
EP  - 381
SN  - 1951-6851
UR  - https://doi.org/10.2991/icsma-16.2016.67
DO  - 10.2991/icsma-16.2016.67
ID  - Li2016/12
ER  -