Proceedings of the 4th 2016 International Conference on Material Science and Engineering (ICMSE 2016)

General Chair

  • Qifeng Hu

    University of Virginia, USA

  • Qiquan Qiao

    University of Virginia, USA

Co-editor

  • Haizheng Tao

    Wuhan University of Technology

  • Yujun Song

    University of Science & Technology Beijing

The Technical Program Committee

  • Fei Zhao

    Guizhou University, China

  • Yuzeng Chen

    Northwestern Polytechnical University, China

  • Qiquan Qiao

    South Dakota State University, USA

  • Wenyu Ma

    University of Science & Technology Beijing, China

  • Chenguang Yan

    Hebei University of Technology and Science, China

  • Fan Jiang

    Guangzhou University, China

  • Jianhong Xu

    Tsinghua University, China

  • Xueqian Fang

    Shijiazhuang Tiedao University, China

  • Liyuan Sheng

    Shenzhen Institute,Peking University, China

  • Mahmood M. Shokrieh

    Iran University, Iran

  • Yongcheng Lin

    Central South University, China

  • Guang Yang

    Donghua University China, China

  • Jicai Kuai

    Henan Polytechnic University, China

  • Zhanying Liu

    North China University of Science and Technology, China

  • Yuhua Wang

    Wuhan University of Science and Technology, China

  • Juntong Huang

    Nanchang Hangkong University, China

  • Wenjin Yue

    Anhui Polytechnic University, China

  • Ke Wang

    Huaqiao University, China

  • Ningbo Liao

    Wenzhou University, China

  • Renjie Ji

    China University of Petroleum, China

  • Yueli Liu

    Wuhan University of Technology, China

  • Chunzhong Li

    East China University of Science and Technology, China

  • Haoyu Shen

    Ningbo Institute of Technology, Zhejiang University, China

  • Majid Montazer

    Amirkabir University of Technology, Iran

  • Fei Wang

    Hebei University Of Technology, China

  • Xuemin Zhang

    Chang'an University, China

  • Xinman Chen

    Shouth China Normal University, China

  • Boming Yu

    Huazhong University of Sci. & Tech, China

  • Wenbo Liu

    Sichuan University, China

  • Xueping Zheng

    Chang'an University, China

  • Zhaolin Liu

    Hebei University of Science & Technology, China

  • Haizheng Tao

    Wuhan University of Technology China

  • Yujun Song

    University of Science & Technology Beijing China

  • Qian Lv

    Western Digital Inc., USA

  • Mingsi Su

    Lanzhou University, China

  • Wei Li

    Jinan University, China

  • Tan Li

    Huazhong University of Science and Technology, China

  • Xiao Fu

    China University of Science and Technology, China

  • Fuling Zhang

    Hunan University, China

  • Yuejun Zhao

    Hubei University of Technology, China

  • Xuzhong Li

    Xi'an Jiaotong University, China

  • Vikas K. Kaushal

    Samsung Austin Semiconductor, USA

  • Bo Yan

    Zhejiang University, China

  • Nan Wu

    Purdue University, USA

  • Yanbin Li

    Guanxi University, China

  • Dongmei Yang

    China University of Petroleum, China

  • Tianhui Ruo

    Shenzheng University, China

  • Yibin Song

    Jilin University, China

  • Yong Xu

    Quzhou University, China

  • Huazhou Liu

    Google Inc, USA

  • Qing Qin

    Beihang University, China

  • Fan Wang

    Changsha University of Science and Technology, China

  • Xiaoping Xu

    Wuhan Institute of Technology, China

  • Xiaohua Jia

    Hongkong University, China

  • Dejiang Zhang

    Xinjiang University, China

  • Yun Wang

    Hainan University, China

  • Jiahui Zhang

    Shaoxin University, China

  • Chunli Zhang

    Xiangtan University, China

  • Dinesh Pathak

    University of Pardubice, Czech Republic

  • Fang He

    Sichuan University, China