Study on Cutting Mechanism of Monocrystalline Silicon Using Molecular Dynamics on Nanometric Scale

DOI

10.2991/icmsa-15.2015.22How to use a DOI?

Keywords

Molecular Dynamics, Modeling, Mechanism of Nanometric Machining.

Abstract

Using molecular dynamics simulation method study the mechanism of nanometric cutting of monocrytalline silicon. We used LAMMPS software programming to establish model.Through VMD video software to display the image of cutting process and combining with the change of potential and temperature, we understand the machining mechanism of nanometric cutting of single crystal silicon is the deformation of amorphous phase change produced rather than plastic deformation. We also found, among cutting parameters, cutting depth has a great impact on surface quality of workpiece.

Copyright

© 2015, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Li-Qiu Shi
AU  - Jia-Xin Xie
AU  - Ming-Dong Xi
AU  - Xiao-Hai Li
AU  - Feng Yu
PY  - 2014/06
DA  - 2014/06
TI  - Study on Cutting Mechanism of Monocrystalline Silicon Using Molecular Dynamics on Nanometric Scale
BT  - Proceedings of the 2015 International Conference on Material Science and Applications
PB  - Atlantis Press
SP  - 117
EP  - 120
SN  - 2352-541X
UR  - https://doi.org/10.2991/icmsa-15.2015.22
DO  - 10.2991/icmsa-15.2015.22
ID  - Shi2014/06
ER  -