Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications

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Elements Diffusion of the Interface for Be/ 00Cr17Ni14Mo2 Stainless Steel with Cu Interlayer by Vacuum Diffusion Bonding

Authors
Hui Li, Yingkun Gong, Yilin Chen, Fei Duan, Xuan Wang
Corresponding Author
Hui Li
Available Online January 2017.
DOI
10.2991/icmmita-16.2016.311How to use a DOI?
Keywords
beryllium; 00Cr17Ni14Mo2 stainless steel; copper; diffusion bonding; element diffusion; interface.
Abstract

Diffusion bonding is an effective way to join beryllium with other materials. To study the elements diffusion on the bonding interface to improve the joints performance, the microstructure, and the distribution of composition and phase on the interface of Be/Cu/00Cr17Ni14Mo2 stainless steel diffusion bonding were analyzed using scanning electron microscopy (SEM), energy dispersive spectrometer (EDS), scanning auger microscopy (SAM), x-ray diffraction (XRD), and the elements diffusion on the interface and the relationship between phases distribution and microstructure were also discussed. The result show that the original interface of Be/Cu diffusion bonding is the most weak site of the whole diffusion bonding zone and the fracture site of specimen. Dissimilar metal atoms gather first in the grain boundary and form intermetallic compounds, and the grain boundary or intermetallic compounds are the main gateway of the elements diffusion. The copper interlayer has greatly hindered the interdiffusion between stainless steel elements and beryllium, so the formation of intermetallic compounds between beryllium and stainless steel elements are avoided effectively to improve the diffusion bonding joints strength.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications
Series
Advances in Computer Science Research
Publication Date
January 2017
ISBN
978-94-6252-285-5
ISSN
2352-538X
DOI
10.2991/icmmita-16.2016.311How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

risenwbib
TY  - CONF
AU  - Hui Li
AU  - Yingkun Gong
AU  - Yilin Chen
AU  - Fei Duan
AU  - Xuan Wang
PY  - 2017/01
DA  - 2017/01
TI  - Elements Diffusion of the Interface for Be/ 00Cr17Ni14Mo2 Stainless Steel with Cu Interlayer by Vacuum Diffusion Bonding
BT  - Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications
PB  - Atlantis Press
SP  - 1389
EP  - 1394
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmita-16.2016.311
DO  - 10.2991/icmmita-16.2016.311
ID  - Li2017/01
ER  -