Bottom-up copper plating to form stacked interconnection of HDI printed circuit board for optical module application

DOI

10.2991/icmmita-16.2016.308How to use a DOI?

Keywords

copper plating; interconnection; plasma; thickness

Abstract

Plating factors of graphic design of copper patterns and plasma pretreatment of dry film were investigated to find their effects on bottom-up plating quality of copper pillars. The thickness of copper pillars is examined using scanning electron microscope. John's Macintosh Product software is used to analyze the thickness distribution of the copper pillars on the surface of the base board. Graphic design of less copper pillars in the surface, dry film with the thickness of 100 m and two-time plasma pretreatment of dry film could result in good plating pillars for stacked interconnection of printed circuit board (PCB). High density interconnection (HDI) PCB can lead to high-speed signal transmission during optical module application.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Jiujuan Li
AU  - Yuanming Chen
AU  - Yongqiang Li
AU  - Na Wen
AU  - Shouxu Wang
AU  - Lijun Gong
AU  - Bei Chen
AU  - Wei He
PY  - 2017/01
DA  - 2017/01
TI  - Bottom-up copper plating to form stacked interconnection of HDI printed circuit board for optical module application
BT  - Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications
PB  - Atlantis Press
SP  - 1373
EP  - 1376
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmita-16.2016.308
DO  - 10.2991/icmmita-16.2016.308
ID  - Li2017/01
ER  -