Research on Magnetron Sputtering CNx Films Process Based on Orthogonal Experimental Design
- https://doi.org/10.2991/icmmita-16.2016.98How to use a DOI?
- CNx films; orthogonal experimental design; surface roughness; magnetron sputtering.
The test scheme of the magnetron sputtering CNx films was designed with the method of orthogonal experiment. The white-light interferometer was used to measure the surface morphology of CNx films. The effects of target current, duty ratio, nitrogen pressure, and bias voltage on surface roughness were investigated simultaneously. The weight orders of the influence of the above factors on the surface roughness of the film were obtained by means of range analysis and levels change trend chart. The results indicate that nitrogen pressure has the most significant effect on the surface roughness. According to the analysis, the optimum process parameters of CNx film prepared by magnetron sputtering were obtained, and the surface roughness of the CNx film prepared by the parameters was measured. The experimental results show that the film with the process parameters according to orthogonal test analysis has smaller surface roughness.
- © 2017, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Kang Peng AU - Xin-min Shen AU - Jian-zhao Zhou AU - Hong-fei Shang PY - 2017/01 DA - 2017/01 TI - Research on Magnetron Sputtering CNx Films Process Based on Orthogonal Experimental Design BT - Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications PB - Atlantis Press SP - 530 EP - 536 SN - 2352-538X UR - https://doi.org/10.2991/icmmita-16.2016.98 DO - https://doi.org/10.2991/icmmita-16.2016.98 ID - Peng2017/01 ER -