Research on Magnetron Sputtering CNx Films Process Based on Orthogonal Experimental Design

DOI

10.2991/icmmita-16.2016.98How to use a DOI?

Keywords

CNx films; orthogonal experimental design; surface roughness; magnetron sputtering.

Abstract

The test scheme of the magnetron sputtering CNx films was designed with the method of orthogonal experiment. The white-light interferometer was used to measure the surface morphology of CNx films. The effects of target current, duty ratio, nitrogen pressure, and bias voltage on surface roughness were investigated simultaneously. The weight orders of the influence of the above factors on the surface roughness of the film were obtained by means of range analysis and levels change trend chart. The results indicate that nitrogen pressure has the most significant effect on the surface roughness. According to the analysis, the optimum process parameters of CNx film prepared by magnetron sputtering were obtained, and the surface roughness of the CNx film prepared by the parameters was measured. The experimental results show that the film with the process parameters according to orthogonal test analysis has smaller surface roughness.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Kang Peng
AU  - Xin-min Shen
AU  - Jian-zhao Zhou
AU  - Hong-fei Shang
PY  - 2017/01
DA  - 2017/01
TI  - Research on Magnetron Sputtering CNx Films Process Based on Orthogonal Experimental Design
BT  - Proceedings of the 2016 4th International Conference on Machinery, Materials and Information Technology Applications
PB  - Atlantis Press
SP  - 530
EP  - 536
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmmita-16.2016.98
DO  - 10.2991/icmmita-16.2016.98
ID  - Peng2017/01
ER  -