Proceedings of the 2nd International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2017)

Static Analysis of Coupled Micro - beams at both Ends of Electromechanical Coupling

Authors
Ning Sun, Dawei Chen, Daolin Jiang
Corresponding Author
Ning Sun
Available Online May 2017.
DOI
10.2991/icmeit-17.2017.71How to use a DOI?
Keywords
MEMS, Fixed beam at both ends, The deflection, Thickness.
Abstract

In the micro electro-mechanical system, the electrostatic coupling of the micro-beam at both ends is often used as the driving structure, so it is very important to study the static analysis of the micro-beam structure. The relationship between the geometric structure parameters and the maximum deflection is analyzed by using the Trans coupling unit of Trans126 in ANASYS, and the relationship between the flexural rigidity and the thickness of the micro-beads in the micro electro-mechanical structure is further revealed.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2017)
Series
Advances in Computer Science Research
Publication Date
May 2017
ISBN
978-94-6252-338-8
ISSN
2352-538X
DOI
10.2991/icmeit-17.2017.71How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Ning Sun
AU  - Dawei Chen
AU  - Daolin Jiang
PY  - 2017/05
DA  - 2017/05
TI  - Static Analysis of Coupled Micro - beams at both Ends of Electromechanical Coupling
BT  - Proceedings of the 2nd International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2017)
PB  - Atlantis Press
SP  - 365
EP  - 368
SN  - 2352-538X
UR  - https://doi.org/10.2991/icmeit-17.2017.71
DO  - 10.2991/icmeit-17.2017.71
ID  - Sun2017/05
ER  -