Coupled Physical Field Simulation based on Comsol

DOI

10.2991/978-94-6463-518-8_58How to use a DOI?

Keywords

Coupled field; Simulation; MATLAB

Abstract

This paper investigates the effects of coupled physical fields on silicon materials using COMSOL Multiphysics and MATLAB, emphasizing the importance of multiphysics field coupling in material science, microelectronics, and interdisciplinary research. It builds upon foundational theories in electronic system-level design and multiphysics applications to explore the behavior of silicon materials under various physical conditions. The research methodology involves constructing a geometric model of a silicon rectangular prism and simulating different deformation scenarios—bending, elongation, and torsion—through physical field simulations. The study utilizes the superposition of mechanical and electrical fields to observe complex interactions within the material, demonstrating COMSOL's capability in handling dynamic simulations. Significant findings include detailed visualizations of deformation effects and their impact on electrical properties, providing a comprehensive understanding of material behavior under complex loading conditions. The integration of MATLAB enhances data analysis and visualization, facilitating a deeper insight into the interplay between mechanical stresses and electrical characteristics. Overall, the study showcases the robust capabilities of COMSOL and MATLAB in advancing material science research, offering innovative methodologies for simulating complex physical interactions and promoting technological education and interdisciplinary applications. This research contributes to the development of new materials and optimization of product design, highlighting the relevance of simulation tools in bridging theoretical research with practical applications.

Copyright

© 2024 The Author(s)

Open Access

Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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TY  - CONF
AU  - Yue Liu
PY  - 2024
DA  - 2024/09/28
TI  - Coupled Physical Field Simulation based on Comsol
BT  - Proceedings of the 2024 International Conference on Mechanics, Electronics Engineering and Automation (ICMEEA 2024)
PB  - Atlantis Press
SP  - 611
EP  - 620
SN  - 2352-5401
UR  - https://doi.org/10.2991/978-94-6463-518-8_58
DO  - 10.2991/978-94-6463-518-8_58
ID  - Liu2024
ER  -