FEM Simulation and Analysis of Temperature Field of Environmental Friendly MQL Grinding

DOI

10.2991/iccasp-16.2017.30How to use a DOI?

Keywords

Thermal analysis, MQL, Temperature, FEM

Abstract

This study proposes an approach for the development of a three dimensional transient heat conduction finite element model (FEM) for grinding process. FEM simulates the temperature field in conventional and nanofluid based environmental friendly minimum quantity lubrication (MQL) grinding process. For this FEM simulation the boundary conditions were obtained on the basis of results of the heat transfer on semi-infinite object with a heat source moving along its surface. Instrumented surface grinding machine was used for experimental purpose. Lubricant used for MQL system was water based nanofluids of various concentrations. Nanoparticles of CuO and Al2O3 were used for preparation of nanofluids. Grinding performance was measured in terms of workpiece surface temperature and cutting force. This model can be used to predict the cooling effectiveness of various lubrication systems. Analysis shows that the FEM temperature values matches with the experimental temperature data.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Prashant Patil
AU  - Chandrakant Patil
PY  - 2016/12
DA  - 2016/12
TI  - FEM Simulation and Analysis of Temperature Field of Environmental Friendly MQL Grinding
BT  - Proceedings of the International Conference on Communication and Signal Processing 2016 (ICCASP 2016)
PB  - Atlantis Press
SP  - 182
EP  - 186
SN  - 1951-6851
UR  - https://doi.org/10.2991/iccasp-16.2017.30
DO  - 10.2991/iccasp-16.2017.30
ID  - Patil2016/12
ER  -