Proceedings of the 2015 International Conference on Advanced Engineering Materials and Technology

The Microscopic Structure and Adsorption Performance of Amide Ions on the Mica (001) Surface

Authors
Dan Su, Yuelong Liu, Gousheng Liu
Corresponding Author
Dan Su
Available Online August 2015.
DOI
10.2991/icaemt-15.2015.19How to use a DOI?
Keywords
Molecular dynamics, Amide, Mica, Electrostatic attraction, Hydrogen bond.
Abstract

Molecular dynamics simulation has been empolyed to investigate microscopic structure and the adsorption performance of amide ions on the mica (001) surface in the vacuum. The results drawn from the computed interaction energies show that amides are more effective collectors for mica compared with quaternary amines. In addition to strong electrostatic attractions, the head group H atoms of the adsorbed amide ions can form hydrogen bonds to the bridging oxygen atoms on the mica surface.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

Volume Title
Proceedings of the 2015 International Conference on Advanced Engineering Materials and Technology
Series
Advances in Engineering Research
Publication Date
August 2015
ISBN
10.2991/icaemt-15.2015.19
ISSN
2352-5401
DOI
10.2991/icaemt-15.2015.19How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Dan Su
AU  - Yuelong Liu
AU  - Gousheng Liu
PY  - 2015/08
DA  - 2015/08
TI  - The Microscopic Structure and Adsorption Performance of Amide Ions on the Mica (001) Surface
BT  - Proceedings of the 2015 International Conference on Advanced Engineering Materials and Technology
PB  - Atlantis Press
SP  - 94
EP  - 97
SN  - 2352-5401
UR  - https://doi.org/10.2991/icaemt-15.2015.19
DO  - 10.2991/icaemt-15.2015.19
ID  - Su2015/08
ER  -