Proceedings of the 2023 International Conference on Economic Management，Financial Innovation and Public Service (EMFIPS 2023)

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A Review on the Shock of Sino-US Trade Friction on Semiconductor Industry in China

based on the Perspective of Global Value Chain

Authors
Xirui Yang1, *
1School of Economics, Zhejiang University of Technology, Hangzhou, 310023, China
*Corresponding author. Email: 2580234920@qq.com
Corresponding Author
Xirui Yang
Available Online 21 June 2024.
DOI
10.2991/978-94-6463-441-9_47How to use a DOI?
Keywords
Sino-US trade friction; Global value chain; Semiconductor
Abstract

With the formation of a new international division of labor which takes global value chain as its core, the high-tech industry represented by the semiconductor has gradually become the key point for countries to occupy the top of the value chain and maintain their comparative advantages. However, currently, Sino-US trade friction continues to escalate and the United States has repeatedly lauched trade sanctions in the field of high-tech product trade, posing a great threat to the development of the semiconductor industry in China. By combining relevant literature, this paper finds that the narrowing of technology gap is the fundamental cause of Sino-US trade friction hidden under the surface factor of trade imbalance; The Sino-US trade conflict has a negative impact on global economic welfare of both countries. A number of regulatory measures imposed by the United States on China have curdled the participation and position of the Chinese semiconductor industry in the global value chain.

Copyright
© 2024 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2023 International Conference on Economic Management，Financial Innovation and Public Service (EMFIPS 2023)
Series
Advances in Economics, Business and Management Research
Publication Date
21 June 2024
ISBN
978-94-6463-441-9
ISSN
2352-5428
DOI
10.2991/978-94-6463-441-9_47How to use a DOI?
Copyright
© 2024 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

risenwbib
TY  - CONF
AU  - Xirui Yang
PY  - 2024
DA  - 2024/06/21
TI  - A Review on the Shock of Sino-US Trade Friction on Semiconductor Industry in China
BT  - Proceedings of the 2023 International Conference on Economic Management，Financial Innovation and Public Service (EMFIPS 2023)
PB  - Atlantis Press
SP  - 552
EP  - 563
SN  - 2352-5428
UR  - https://doi.org/10.2991/978-94-6463-441-9_47
DO  - 10.2991/978-94-6463-441-9_47
ID  - Yang2024
ER  -