Simulation of Heat Radiation for High-power LED Liquid Packaging

DOI

10.2991/ame-16.2016.81How to use a DOI?

Keywords

Simulation, Heat radiation, LED, Liquid packaging

Abstract

With the power of LED gradually ascend, LED lighting lamps' heat problems also increasingly exposed. The paper is around the study of high power LED packaging of liquid cooling. Through comparative analysis of DLC metal base, aluminum nitride ceramics and alumina ceramic thermal performance, it is found that traditional packaging junction temperature varies greatly, and liquid packaging junction temperature difference is small. Thus, heat is mainly dissipated through convection of liquid, and the difference of junction temperature is small.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Dong-Sheng Peng
AU  - Dan Zeng
AU  - Cong-Cong Tan
PY  - 2016/06
DA  - 2016/06
TI  - Simulation of Heat Radiation for High-power LED Liquid Packaging
BT  - Proceedings of the 2nd Annual International Conference on Advanced Material Engineering (AME 2016)
PB  - Atlantis Press
SP  - 491
EP  - 494
SN  - 2352-5401
UR  - https://doi.org/10.2991/ame-16.2016.81
DO  - 10.2991/ame-16.2016.81
ID  - Peng2016/06
ER  -