Proceedings of the 2015 International Conference on Artificial Intelligence and Industrial Engineering

Research on Effective Thermal Conductance of the Microbolometer

Authors
L. Zhang, C. Chen, T. Wang, Y. Zhao
Corresponding Author
L. Zhang
Available Online July 2015.
DOI
10.2991/aiie-15.2015.160How to use a DOI?
Keywords
a three-level model; microbolometer; finite element simulation; device thermal conductance; effective thermal conductance; dynamic thermoelectric coupling
Abstract

A three-level model of microbolometer was established by the software of intellisuit. Device thermal conductance Gdev, effective thermal conductance Geff and the theoretical value of device thermal conductance Gthe can be obtained by means of dynamic thermal finite element simulation, dynamic thermoelectric coupling finite element simulation and theoretical calculations respectively. And then the three parameters mentioned above were analyzed and conclusion can be drawn that effective thermal conductance Geff extracted not only can provide some important references for design of microbolometer, but also be more accurate in performance estimating of the device.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2015 International Conference on Artificial Intelligence and Industrial Engineering
Series
Advances in Intelligent Systems Research
Publication Date
July 2015
ISBN
978-94-62520-70-7
ISSN
1951-6851
DOI
10.2991/aiie-15.2015.160How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - L. Zhang
AU  - C. Chen
AU  - T. Wang
AU  - Y. Zhao
PY  - 2015/07
DA  - 2015/07
TI  - Research on Effective Thermal Conductance of the Microbolometer
BT  - Proceedings of the 2015 International Conference on Artificial Intelligence and Industrial Engineering
PB  - Atlantis Press
SP  - 601
EP  - 604
SN  - 1951-6851
UR  - https://doi.org/10.2991/aiie-15.2015.160
DO  - 10.2991/aiie-15.2015.160
ID  - Zhang2015/07
ER  -