Fabrication of SiCp/Cu Composites with SiCw/SiCnp hybrid addition

DOI

10.2991/aiea-16.2016.76How to use a DOI?

Keywords

Electro-less plating; Copper matrix; Hot-press sintering; Hybrid addition.

Abstract

SiCp/Cu hybrid composites were fabricated by hot press sintering technology. Micron SiC particle (SiCp), SiC wisker (SiCw) and nano SiC particle (SiCnp) were chosen as hybrid reinforcement. The reinforcement distributed uniform in the substrate after electro-less plating. XRD, SEM and Vickers hardness apparatus were utilized to character phase constitution, surface morphology and hardness of SiCp/Cu composites. The result showed that addition of nano-SiCp improve Vickers' hardness and bending strength compared with SiCw and SiC(w+np) hybrid material.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Peiling Ding
AU  - Yunlong Zhang
AU  - Xiaoxue Ren
AU  - Ming Hu
PY  - 2016/11
DA  - 2016/11
TI  - Fabrication of SiCp/Cu Composites with SiCw/SiCnp hybrid addition
BT  - Proceedings of the 2016 International Conference on Artificial Intelligence and Engineering Applications
PB  - Atlantis Press
SP  - 429
EP  - 432
SN  - 2352-538X
UR  - https://doi.org/10.2991/aiea-16.2016.76
DO  - 10.2991/aiea-16.2016.76
ID  - Ding2016/11
ER  -