Fabrication of SiCp/Cu Composites with SiCw/SiCnp hybrid addition
Peiling Ding, Yunlong Zhang, Xiaoxue Ren, Ming Hu
Available Online November 2016.
- 10.2991/aiea-16.2016.76How to use a DOI?
- Electro-less plating; Copper matrix; Hot-press sintering; Hybrid addition.
SiCp/Cu hybrid composites were fabricated by hot press sintering technology. Micron SiC particle (SiCp), SiC wisker (SiCw) and nano SiC particle (SiCnp) were chosen as hybrid reinforcement. The reinforcement distributed uniform in the substrate after electro-less plating. XRD, SEM and Vickers hardness apparatus were utilized to character phase constitution, surface morphology and hardness of SiCp/Cu composites. The result showed that addition of nano-SiCp improve Vickers' hardness and bending strength compared with SiCw and SiC(w+np) hybrid material.
- © 2016, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Peiling Ding AU - Yunlong Zhang AU - Xiaoxue Ren AU - Ming Hu PY - 2016/11 DA - 2016/11 TI - Fabrication of SiCp/Cu Composites with SiCw/SiCnp hybrid addition BT - Proceedings of the 2016 International Conference on Artificial Intelligence and Engineering Applications PB - Atlantis Press SP - 429 EP - 432 SN - 2352-538X UR - https://doi.org/10.2991/aiea-16.2016.76 DO - 10.2991/aiea-16.2016.76 ID - Ding2016/11 ER -