Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application

DOI

10.2991/msota-16.2016.107How to use a DOI?

Keywords

printed circuit board; ball grid array; simulation; drop

Abstract

In this paper, finite element analysis was carried out to simulate the response of printed circuit board (PCB) assembly that fell and collided with a rigid surface using dropping simulation. The drop process was simulated by setting the drop parameters including falling directions and falling heights. The results revealed that 180ødrop had the most severe damage for BGA solder joints. It also indicated that dynamic bending of the PCB resulted from the solder stress.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

TY  - CONF
AU  - Shouxu Wang
AU  - Yunzhao Chen
AU  - Li Zheng
AU  - Yuanming Chen
AU  - Huaiwu Zhang
AU  - Lijun Gong
AU  - Bei Chen
AU  - Wei He
PY  - 2016/12
DA  - 2016/12
TI  - Dropping Simulation of Printed Circuit Board with BGA Soldering Assembly for Optical Module Application
BT  - Proceedings of 2016 International Conference on Modeling, Simulation and Optimization Technologies and Applications (MSOTA2016)
PB  - Atlantis Press
SP  - 477
EP  - 479
SN  - 2352-538X
UR  - https://doi.org/10.2991/msota-16.2016.107
DO  - 10.2991/msota-16.2016.107
ID  - Wang2016/12
ER  -