Design and Process Parameters Research of Single-Laser Stripping Platform Based on Automatic Double-Position Flipping Mechanism

DOI

10.2991/mme-16.2017.40How to use a DOI?

Keywords

Laser stripping, Flip platform, Bi-directional stripping, Process parameters.

Abstract

It is obvious that mechanical stripping is unable to meet the requirements for the stripping of extremely thin wires. Laser stripping has been widely used for its easy integration with electromechanical equipment and high controllability. Currently most laser stripping devices have to utilize double lasers, resulting in high-cost. To solve this problem, a single-laser stripping platform based on automatic double-position flipping is designed. This platform can realize bi-directional stripping with only one laser through automatic double-position flipping. Compared with double-laser stripping platform, the single-laser one can meet the requirements of stripping production with slightly longer stripping time per row of wires but is only half the cost and of the same stripping quality, making it ideal for most medium and small companies. Research has been done on this device of mobile phone antenna stripping. The optimal process parameter has been obtained.

Copyright

© 2017, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Wei-Bing Liu
AU  - Gui-Lin Yang
AU  - Ming-Di Wang
PY  - 2016/12
DA  - 2016/12
TI  - Design and Process Parameters Research of Single-Laser Stripping Platform Based on Automatic Double-Position Flipping Mechanism
BT  - Proceedings of the 3rd Annual International Conference on Mechanics and Mechanical Engineering (MME 2016)
PB  - Atlantis Press
SP  - 291
EP  - 297
SN  - 2352-5401
UR  - https://doi.org/10.2991/mme-16.2017.40
DO  - 10.2991/mme-16.2017.40
ID  - Liu2016/12
ER  -