Research on Fatigue For AlN - Cu Plate Jointed By DBC Method For Semi-Conductor Substrate

DOI

10.2991/jiaet-18.2018.29How to use a DOI?

Keywords

Residual stress, Stress intensity factor, thermal expansion coefficient

Abstract

A elastic-plastic analysis of AlN/Cu jointing plate was performed by FEM to study the residual stress produced in the jointing-cooling process. This residual stress due to the difference of thermal expansion coefficient between ceramics and metal was analyzed, considering the presence of initial defects in ceramics. A static fatigue life was estimated based on a stress intensity factor of the supper-posed stress of the residual stress and the bending stress in ceramics of AlN/Cu jointing plate with the various thickness of Al2O3 layer.

Copyright

© 2018, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Qiao Ling Zhang
AU  - Ting Ai
AU  - Hao Kang
PY  - 2018/03
DA  - 2018/03
TI  - Research on Fatigue For AlN - Cu Plate Jointed By DBC Method For Semi-Conductor Substrate
BT  - Proceedings of the 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018)
PB  - Atlantis Press
SP  - 167
EP  - 170
SN  - 2352-5401
UR  - https://doi.org/10.2991/jiaet-18.2018.29
DO  - 10.2991/jiaet-18.2018.29
ID  - Zhang2018/03
ER  -