Proceedings of the 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018)

Research on preparation and properties of isothermal solidification Cu-Sn high temperature solder paste

Authors
Manmen Liu, Jialin Chen, Hao Cui, Xudong Sun, Shaohong Liu, Ming Xie, Xiaoli Zhu
Corresponding Author
Manmen Liu
Available Online March 2018.
DOI
https://doi.org/10.2991/jiaet-18.2018.1How to use a DOI?
Keywords
Pb-free solder; Isothermal solidification; Diffusion; Shear strength
Abstract

A novel environmental-friendly Cu-Sn high temperature solder paste was fabricated by mixing Cu powder, Sn powder and commercial purchased flux. Different type and content of the flux may significantly affect the thermal properties of the solder paste. The bonding layer was composed of compact Cu3Sn and loose Cu6Sn5. The thickness of the Cu3Sn layer increased with the extension of the bonding time. The high temperature (at 300°C) shear strength of the bonding layer bonded under pressure of 10MPa was 23 MPa.

Copyright
© 2018, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018)
Series
Advances in Engineering Research
Publication Date
March 2018
ISBN
978-94-6252-507-8
ISSN
2352-5401
DOI
https://doi.org/10.2991/jiaet-18.2018.1How to use a DOI?
Copyright
© 2018, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Manmen Liu
AU  - Jialin Chen
AU  - Hao Cui
AU  - Xudong Sun
AU  - Shaohong Liu
AU  - Ming Xie
AU  - Xiaoli Zhu
PY  - 2018/03
DA  - 2018/03
TI  - Research on preparation and properties of isothermal solidification Cu-Sn high temperature solder paste
BT  - Proceedings of the 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018)
PB  - Atlantis Press
SP  - 1
EP  - 5
SN  - 2352-5401
UR  - https://doi.org/10.2991/jiaet-18.2018.1
DO  - https://doi.org/10.2991/jiaet-18.2018.1
ID  - Liu2018/03
ER  -