Research on preparation and properties of isothermal solidification Cu-Sn high temperature solder paste
- https://doi.org/10.2991/jiaet-18.2018.1How to use a DOI?
- Pb-free solder; Isothermal solidification; Diffusion; Shear strength
A novel environmental-friendly Cu-Sn high temperature solder paste was fabricated by mixing Cu powder, Sn powder and commercial purchased flux. Different type and content of the flux may significantly affect the thermal properties of the solder paste. The bonding layer was composed of compact Cu3Sn and loose Cu6Sn5. The thickness of the Cu3Sn layer increased with the extension of the bonding time. The high temperature (at 300°C) shear strength of the bonding layer bonded under pressure of 10MPa was 23 MPa.
- © 2018, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Manmen Liu AU - Jialin Chen AU - Hao Cui AU - Xudong Sun AU - Shaohong Liu AU - Ming Xie AU - Xiaoli Zhu PY - 2018/03 DA - 2018/03 TI - Research on preparation and properties of isothermal solidification Cu-Sn high temperature solder paste BT - Proceedings of the 2018 Joint International Advanced Engineering and Technology Research Conference (JIAET 2018) PB - Atlantis Press SP - 1 EP - 5 SN - 2352-5401 UR - https://doi.org/10.2991/jiaet-18.2018.1 DO - https://doi.org/10.2991/jiaet-18.2018.1 ID - Liu2018/03 ER -