An In-situ Method for Comparing Thermal Conductivity of Insulation Film in MEMS

DOI

10.2991/isaeece-16.2016.20How to use a DOI?

Keywords

Infrared Imager, Thermal conductivity, AlN /PI, MEMS

Abstract

A effective method for comparing the thermal conductivity of insulation film was developed here. The thermal simulation on Ansys software indicated that different materials at same thickness exhibit different temperature distribution in this system. Base on this, the new measurement structure was fabricated by MEMS process. The results by Infrared Imager exhibited similar trends with the simulation. So the AlN/Polyimide nanocomposites film at different AlN content are compared based on this. The result shows that the AlN/PI at content(40%) has the high thermal conductivity. What’s more, this method can effectively and conveniently In-situ compare the thermal conductivity of insulation film in MEMS.

Copyright

© 2016, the Authors. Published by Atlantis Press.

Open Access

This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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TY  - CONF
AU  - Zhe Liu
AU  - Jiangbo Luo
AU  - Guifu Ding
PY  - 2016/04
DA  - 2016/04
TI  - An In-situ Method for Comparing Thermal Conductivity of Insulation Film in MEMS
BT  - Proceedings of the 2016 International Symposium on Advances in Electrical, Electronics and Computer Engineering
PB  - Atlantis Press
SP  - 95
EP  - 98
SN  - 2352-5401
UR  - https://doi.org/10.2991/isaeece-16.2016.20
DO  - 10.2991/isaeece-16.2016.20
ID  - Liu2016/04
ER  -