Proceedings of the 2016 International Conference on Mechatronics Engineering and Information Technology

Impacts of Groundwater Heat Pump System on Microorganism Growth in Beijing Plain, China

Authors
Binghua Li, Licai Liu, Qijun Li, Junxiong Huang, Yong Yang
Corresponding Author
Binghua Li
Available Online August 2016.
DOI
10.2991/icmeit-16.2016.51How to use a DOI?
Keywords
groundwater heat pump, temperature, pH, bacteria, escherichia coli.
Abstract

Here one demonstration project of groundwater heat pump (GWHP) system in Beijing plain, China, was selected to study impact of temperature, pH, and ratio of carbon and nitrogen in groundwater on the growth of microorganism. Results showed that pH, and ratio of carbon and nitrogen had little influence, while temperature played an important role. When temperature was higher or lower than 13.20C, the amount of Escherichia coli and bacteria showed a decreasing trend roughly consistent with the normal distribution. Meanwhile, based on the monitored data, the relationship between groundwater temperature and the capacity of E. coli and bacteria were summarized.

Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2016 International Conference on Mechatronics Engineering and Information Technology
Series
Advances in Engineering Research
Publication Date
August 2016
ISBN
10.2991/icmeit-16.2016.51
ISSN
2352-5401
DOI
10.2991/icmeit-16.2016.51How to use a DOI?
Copyright
© 2016, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Binghua Li
AU  - Licai Liu
AU  - Qijun Li
AU  - Junxiong Huang
AU  - Yong Yang
PY  - 2016/08
DA  - 2016/08
TI  - Impacts of Groundwater Heat Pump System on Microorganism Growth in Beijing Plain, China
BT  - Proceedings of the 2016 International Conference on Mechatronics Engineering and Information Technology
PB  - Atlantis Press
SP  - 270
EP  - 274
SN  - 2352-5401
UR  - https://doi.org/10.2991/icmeit-16.2016.51
DO  - 10.2991/icmeit-16.2016.51
ID  - Li2016/08
ER  -