Proceedings of the 2nd International Conference on Intelligent Design and Innovative Technology (ICIDIT 2023)

Development and Application of Intelligent Packaging Design under the Background of Artificial Intelligence

Authors
Chaowei Wang1, *, Lanyu Liu1, Zheng Wang1
1Department of Industrial Design, Wuhan University of Technology, Wuhan, China
*Corresponding author. Email: ch16we@163.com
Corresponding Author
Chaowei Wang
Available Online 10 October 2023.
DOI
10.2991/978-94-6463-266-8_33How to use a DOI?
Keywords
Artificial intelligence; Intelligent packaging; Packaging design; Value system
ABSTRACT

Digital technologies such as artificial intelligence and big data are transforming traditional industries, including intelligent packaging design. As the manufacturing industry develops, consumer expectations for packaging are increasing, presenting challenges for technological innovation and integrated development of intelligent packaging. This paper explores these challenges and proposes strategies for organic integration of technology, environmental protection, and aesthetics in intelligent packaging design. These strategies include strengthening technological innovation, improving environmental performance, emphasizing aesthetic design, and guiding consumer consumption concepts to improve the added value and market competitiveness of packaging.

Copyright
© 2024 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

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Volume Title
Proceedings of the 2nd International Conference on Intelligent Design and Innovative Technology (ICIDIT 2023)
Series
Atlantis Highlights in Intelligent Systems
Publication Date
10 October 2023
ISBN
10.2991/978-94-6463-266-8_33
ISSN
2589-4919
DOI
10.2991/978-94-6463-266-8_33How to use a DOI?
Copyright
© 2024 The Author(s)
Open Access
Open Access This chapter is licensed under the terms of the Creative Commons Attribution-NonCommercial 4.0 International License (http://creativecommons.org/licenses/by-nc/4.0/), which permits any noncommercial use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license and indicate if changes were made.

Cite this article

TY  - CONF
AU  - Chaowei Wang
AU  - Lanyu Liu
AU  - Zheng Wang
PY  - 2023
DA  - 2023/10/10
TI  - Development and Application of Intelligent Packaging Design under the Background of Artificial Intelligence
BT  - Proceedings of the 2nd International Conference on Intelligent Design and Innovative Technology (ICIDIT 2023)
PB  - Atlantis Press
SP  - 308
EP  - 318
SN  - 2589-4919
UR  - https://doi.org/10.2991/978-94-6463-266-8_33
DO  - 10.2991/978-94-6463-266-8_33
ID  - Wang2023
ER  -