Proceedings of the 2015 4th International Conference on Computer, Mechatronics, Control and Electronic Engineering

Study on Dynamic Prediction of Thermal Response for Aircraft Device Cabin

Authors
Shichao Liu, Liping Pang
Corresponding Author
Shichao Liu
Available Online November 2015.
DOI
10.2991/iccmcee-15.2015.111How to use a DOI?
Keywords
Dynamic simulation; Thermal network model; Thermal environment; Aircraft cabin
Abstract

The effect of aerodynamic heating is obvious for hypersonic aircrafts. Its temperature change of cabin electronic devices is obvious under this severe working condition. Therefore, for this type of aircraft, it is important to design the thermal protecting system and evaluate the impact on electrical devices. It is valuable for the designer to obtain the results of the dynamic prediction of thermal response accurately in advance. The aim of this paper is to establish a thermal network model based on Kirchhoff’s circuit laws through an analogy of electrical and thermal systems. The simulation model is solved by using numeric simulation method. The presented thermal network model can realize the quick thermal response of the wall insulation and cabin devices due to aerodynamic heating, and then obtain the transient thermal simulation results of aircraft internal device. Comparisons with the reliable commercial Sinda/Fluent model show that the presented model has a good prediction accuracy. Therefore, the presented model can realize the accurate prediction of the transient heat transfer inside the cabin in a short time.

Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Download article (PDF)

Volume Title
Proceedings of the 2015 4th International Conference on Computer, Mechatronics, Control and Electronic Engineering
Series
Advances in Engineering Research
Publication Date
November 2015
ISBN
10.2991/iccmcee-15.2015.111
ISSN
2352-5401
DOI
10.2991/iccmcee-15.2015.111How to use a DOI?
Copyright
© 2015, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Shichao Liu
AU  - Liping Pang
PY  - 2015/11
DA  - 2015/11
TI  - Study on Dynamic Prediction of Thermal Response for Aircraft Device Cabin
BT  - Proceedings of the 2015 4th International Conference on Computer, Mechatronics, Control and Electronic Engineering
PB  - Atlantis Press
SP  - 613
EP  - 618
SN  - 2352-5401
UR  - https://doi.org/10.2991/iccmcee-15.2015.111
DO  - 10.2991/iccmcee-15.2015.111
ID  - Liu2015/11
ER  -