Proceedings of the 2nd International Conference on Computer Engineering, Information Science & Application Technology (ICCIA 2017)

A Novel Approach for Shock Absorber----Colloidal Damper

Authors
Muchun Yu, Zhiling Niu, Peng Zhao, Zijun Zhang
Corresponding Author
Muchun Yu
Available Online July 2016.
DOI
10.2991/iccia-17.2017.151How to use a DOI?
Keywords
Colloidal damper, shock absorber, hydrophobic nanoporous materials, energy dissipation.
Abstract

Using the mixture of nanoporous materials and its associated lyophobic fluid for damping application is a novel technology called colloidal damper. Compression caused liquid intrusion transfers the mechanical energy into interface energy and so that producing damping effect and colloidal damper has great potential as shock absorber. In this paper, a colloidal damper consist water and hydrophobic silica gel particles as working medium is investigated. The working mechanism of colloidal is first introduced. Then, an experiment is conducted to investigate the mechanical properties of colloidal damper. Finally, the energy dissipation performance is analyzed.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd International Conference on Computer Engineering, Information Science & Application Technology (ICCIA 2017)
Series
Advances in Computer Science Research
Publication Date
July 2016
ISBN
10.2991/iccia-17.2017.151
ISSN
2352-538X
DOI
10.2991/iccia-17.2017.151How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Muchun Yu
AU  - Zhiling Niu
AU  - Peng Zhao
AU  - Zijun Zhang
PY  - 2016/07
DA  - 2016/07
TI  - A Novel Approach for Shock Absorber----Colloidal Damper
BT  - Proceedings of the 2nd International Conference on Computer Engineering, Information Science & Application Technology (ICCIA 2017)
PB  - Atlantis Press
SP  - 861
EP  - 867
SN  - 2352-538X
UR  - https://doi.org/10.2991/iccia-17.2017.151
DO  - 10.2991/iccia-17.2017.151
ID  - Yu2016/07
ER  -