Proceedings of the 2018 3rd International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE 2018)

Research status of metal/diamond interface

Authors
Chang Zhang, Fengbin Liu
Corresponding Author
Chang Zhang
Available Online May 2018.
DOI
10.2991/icammce-18.2018.103How to use a DOI?
Keywords
diamond films, interface bonding, preparation methods, electrical properties, mechanical propertie
Abstract

The high thermal conductivity of diamond makes it very promising in the field of semiconductor devices, and the application of diamond film in electronic devices will inevitably involve the problem of contact with metal. What kind of metal/diamond interface that has good electrical and mechanical properties. Which method can obtain a more stable interface between the metal/diamond. Scientists have done a lot of research in these aspects, but there is no definite conclusion at present. This paper focuses on the preparation methods of metal/diamond interfaces, and the electrical and mechanical properties of the interfaces.

Copyright
© 2018, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2018 3rd International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE 2018)
Series
Advances in Engineering Research
Publication Date
May 2018
ISBN
978-94-6252-525-2
ISSN
2352-5401
DOI
10.2991/icammce-18.2018.103How to use a DOI?
Copyright
© 2018, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Chang Zhang
AU  - Fengbin Liu
PY  - 2018/05
DA  - 2018/05
TI  - Research status of metal/diamond interface
BT  - Proceedings of the 2018 3rd International Conference on Advances in Materials, Mechatronics and Civil Engineering (ICAMMCE 2018)
PB  - Atlantis Press
SP  - 481
EP  - 486
SN  - 2352-5401
UR  - https://doi.org/10.2991/icammce-18.2018.103
DO  - 10.2991/icammce-18.2018.103
ID  - Zhang2018/05
ER  -