Development of High Temperature Pressure Sensor for Oil and Gas Field Based on SOI
- https://doi.org/10.2991/ic3me-15.2015.274How to use a DOI?
- high temperature pressure sensor; silicon on insulator; anodic bonding; corrugated diaphragm; packaging
According to the pressure testing requirements under high temperature and high pressure environment in oil and gas field, this paper introduced the design and development of a kind of high temperature high pressure sensor chip, and solved the problems of thermal stability of traditional piezoresistive sensors in special environment. The method of packaging SOI piezoresistive chip of high temperature resistance and glass plate in one through technology of anodic bonding under circumstance of vacuum, solved the problem of wide measurement range of pressure under high temperature circumstance. Meanwhile, insulating the medium under investigation from sensor chips by adopting corrugated diaphragm and high-temperature silicon oil as isolation materials, improved the adaptability of sensors.
- © 2015, the Authors. Published by Atlantis Press.
- Open Access
- This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).
Cite this article
TY - CONF AU - Yong Chen AU - Xiaohong Bai AU - Shuqin Xiao PY - 2015/08 DA - 2015/08 TI - Development of High Temperature Pressure Sensor for Oil and Gas Field Based on SOI BT - Proceedings of the 3rd International Conference on Material, Mechanical and Manufacturing Engineering PB - Atlantis Press SP - 1421 EP - 1425 SN - 2352-5401 UR - https://doi.org/10.2991/ic3me-15.2015.274 DO - https://doi.org/10.2991/ic3me-15.2015.274 ID - Chen2015/08 ER -