Proceedings of the 2nd International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT 2012)

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Building Moisture Load Analysis Based on Heat and Mass Coupled Transfer

Authors
Fanhong Kong
Corresponding Author
Fanhong Kong
Available Online September 2012.
DOI
10.2991/emeit.2012.110How to use a DOI?
Keywords
new-built building, heat and mass coupled transfer, modeled room moisture load, different setting
Abstract

The conventional calculation of building indoor moisture load of always omits the effect of interior moisture release of envelope. However, its effect especially that of new-completely energy-saving building is very large. The paper, which took the new-built building in Harbin as an example, analyzed the effect of heat and mass coupled transfer envelope on modeled room moisture load in cold serious areas. The moisture load modeled results of multilayer envelopes with different setting were contrasted in the first four years use. The result showed that, for a new-built building, the using of vapor retarder on interior of insulation layer or glazed brick on exterior of envelope would increase the moisture load, which would be reduced if defer the time for plastering glazed brick.

Copyright
© 2012, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT 2012)
Series
Advances in Intelligent Systems Research
Publication Date
September 2012
ISBN
10.2991/emeit.2012.110
ISSN
1951-6851
DOI
10.2991/emeit.2012.110How to use a DOI?
Copyright
© 2012, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

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TY  - CONF
AU  - Fanhong Kong
PY  - 2012/09
DA  - 2012/09
TI  - Building Moisture Load Analysis Based on Heat and Mass Coupled Transfer
BT  - Proceedings of the 2nd International Conference on Electronic & Mechanical Engineering and Information Technology (EMEIT 2012)
PB  - Atlantis Press
SP  - 531
EP  - 534
SN  - 1951-6851
UR  - https://doi.org/10.2991/emeit.2012.110
DO  - 10.2991/emeit.2012.110
ID  - Kong2012/09
ER  -