Proceedings of the 2nd Annual International Conference on Electronics, Electrical Engineering and Information Science (EEEIS 2016)

The design of a high-temperature MEMS pressure sensor with integrated temperature compensation and signal-conditioning circuits

Authors
Zong Yao, Wang-Wang Li, Di-Ya Zhang, Lei Qi, Bin Zhang, Cheng Lei, Xin Li, Ting Liang, Ji-Jun Xiong
Corresponding Author
Zong Yao
Available Online December 2016.
DOI
10.2991/eeeis-16.2017.51How to use a DOI?
Keywords
High-temperature piezoresistive pressure sensor; Temperature compensation; Signal-conditioning circuit
Abstract

A high-temperature MEMS pressure sensor with integrated temperature compensation and signal-conditioning circuits is reported in this work. The paper introduces the design and fabrication of the sensor, including the pressure-sensitive chip, the temperature compensation method, the signal-conditioning circuit and the sensor's assembly structure. According to the test result, the sensor has the advantages of high accuracy and sensitivity, low temperature drift and 0V~5V standard voltage signal output. The sensor can be operated long-term in the range of 50 øC to 220 øC which is expected to be highly applicable to pressure measurements in harsh environments.

Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

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Volume Title
Proceedings of the 2nd Annual International Conference on Electronics, Electrical Engineering and Information Science (EEEIS 2016)
Series
Advances in Engineering Research
Publication Date
December 2016
ISBN
978-94-6252-320-3
ISSN
2352-5401
DOI
10.2991/eeeis-16.2017.51How to use a DOI?
Copyright
© 2017, the Authors. Published by Atlantis Press.
Open Access
This is an open access article distributed under the CC BY-NC license (http://creativecommons.org/licenses/by-nc/4.0/).

Cite this article

TY  - CONF
AU  - Zong Yao
AU  - Wang-Wang Li
AU  - Di-Ya Zhang
AU  - Lei Qi
AU  - Bin Zhang
AU  - Cheng Lei
AU  - Xin Li
AU  - Ting Liang
AU  - Ji-Jun Xiong
PY  - 2016/12
DA  - 2016/12
TI  - The design of a high-temperature MEMS pressure sensor with integrated temperature compensation and signal-conditioning circuits
BT  - Proceedings of the 2nd Annual International Conference on Electronics, Electrical Engineering and Information Science (EEEIS 2016)
PB  - Atlantis Press
SP  - 395
EP  - 406
SN  - 2352-5401
UR  - https://doi.org/10.2991/eeeis-16.2017.51
DO  - 10.2991/eeeis-16.2017.51
ID  - Yao2016/12
ER  -