Preparation of PMMA/PGMA Blend to Apply for Metallographic Cross Section of Printed Circuit Board
Xue-Mei He, Tao Shen, Shou-Xu Wang, Yuan-Ming Chen, Huai-Wu Zhang, Li-Jun Gong, Bei Chen, Wei He
Available Online April 2017.
- https://doi.org/10.2991/ame-17.2017.46How to use a DOI?
- PMMA/PGMA blend, MMA, GMA, PCB, Metallographic cross section.
- Poly (methyl methacrylate)/poly (glycidyl methacrylate) (PMMA/PGMA) blend was prepared with the reaction of PMMA, glycidyl methacrylate (GMA) and methyl methacrylate (MMA) at room temperature. Effects of the proportions of MMA and GMA were investigated to analyze the performance of PMMA/PGMA blend. When the weight fraction of GMA in GMA/MMA was 0.25, PMMA/PGMA blend exhibited good performance as curing time of 29 min, volume shrinkage of 9.83%, bending strength of 50 MPa, tensile strength of 31 MPa and bonding strength of 1.52 MPa. PMMA/PGMA blend could well cover the cross section of printed circuit board.
- Open Access
- This is an open access article distributed under the CC BY-NC license.
Cite this article
TY - CONF AU - Xue-Mei He AU - Tao Shen AU - Shou-Xu Wang AU - Yuan-Ming Chen AU - Huai-Wu Zhang AU - Li-Jun Gong AU - Bei Chen AU - Wei He PY - 2017/04 DA - 2017/04 TI - Preparation of PMMA/PGMA Blend to Apply for Metallographic Cross Section of Printed Circuit Board BT - 3rd Annual International Conference on Advanced Material Engineering (AME 2017) PB - Atlantis Press SN - 2352-5401 UR - https://doi.org/10.2991/ame-17.2017.46 DO - https://doi.org/10.2991/ame-17.2017.46 ID - He2017/04 ER -