Proceedings of the 3rd Annual International Conference on Advanced Material Engineering (AME 2017)

Preparation of PMMA/PGMA Blend to Apply for Metallographic Cross Section of Printed Circuit Board

Authors
Xue-Mei He, Tao Shen, Shou-Xu Wang, Yuan-Ming Chen, Huai-Wu Zhang, Li-Jun Gong, Bei Chen, Wei He
Corresponding Author
Xue-Mei He
Available Online April 2017.
DOI
https://doi.org/10.2991/ame-17.2017.46How to use a DOI?
Keywords
PMMA/PGMA blend, MMA, GMA, PCB, Metallographic cross section.
Abstract
Poly (methyl methacrylate)/poly (glycidyl methacrylate) (PMMA/PGMA) blend was prepared with the reaction of PMMA, glycidyl methacrylate (GMA) and methyl methacrylate (MMA) at room temperature. Effects of the proportions of MMA and GMA were investigated to analyze the performance of PMMA/PGMA blend. When the weight fraction of GMA in GMA/MMA was 0.25, PMMA/PGMA blend exhibited good performance as curing time of 29 min, volume shrinkage of 9.83%, bending strength of 50 MPa, tensile strength of 31 MPa and bonding strength of 1.52 MPa. PMMA/PGMA blend could well cover the cross section of printed circuit board.
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Proceedings
3rd Annual International Conference on Advanced Material Engineering (AME 2017)
Part of series
Advances in Engineering Research
Publication Date
April 2017
ISBN
978-94-6252-336-4
ISSN
2352-5401
DOI
https://doi.org/10.2991/ame-17.2017.46How to use a DOI?
Open Access
This is an open access article distributed under the CC BY-NC license.

Cite this article

TY  - CONF
AU  - Xue-Mei He
AU  - Tao Shen
AU  - Shou-Xu Wang
AU  - Yuan-Ming Chen
AU  - Huai-Wu Zhang
AU  - Li-Jun Gong
AU  - Bei Chen
AU  - Wei He
PY  - 2017/04
DA  - 2017/04
TI  - Preparation of PMMA/PGMA Blend to Apply for Metallographic Cross Section of Printed Circuit Board
BT  - 3rd Annual International Conference on Advanced Material Engineering (AME 2017)
PB  - Atlantis Press
SN  - 2352-5401
UR  - https://doi.org/10.2991/ame-17.2017.46
DO  - https://doi.org/10.2991/ame-17.2017.46
ID  - He2017/04
ER  -